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Advanced & Machinable
Metal Matrix Composites

Advanced ceramics with
high purity and rigidity for
precision applications

Aluminium Nitride Ceramics AlN

Aluminium Nitride is frequently selected for its thermal conductivity and its resistance to attack by fluorine plasmas.

Applications

  • Chamber parts for Semiconductor Process Equipment
  • Heat Radiation Substrate

Silicon Nitride Ceramics

Properties

      ALN99 ALN94
General Properties Characteristics High purity HighThermal Conductivity
Main Component Purity(wt%) 99 94
Color Light gray Light gray
Density(g/cm3) 3.24 3.31
Water Absorption(%) 0 0
Mechanical Properties Bending Strength(MPa) 295 345
Young's Modulus(GPa) 320 320
Vickers Hardness(GPa) 11 11
Thermal Properties Max.Operating Temperature (°C) 1000 1000
Coefficient of Thermal Expansion (1/°C×10-6) RT~500°C 4.4 4.4
RT~800°C 5.1 5.1
Coefficient of Thermal Conductivity (W/m×K) 80 150
Thermal Shock Resistance ΔT (°C) 300 400
Electrical Properties Volume Resistivity 25°C 1014 1014
300°C 108 1010
500°C 107 107
800°C 105 105
Dielectric Constant 10GHz 8.5 8.5
Dielectric Loss (×10-4) 30 30
Q Factor (×104) 0.03 0.03
Dielectric Breakdown Voltage (KV/mm) - -